Die Bonding

Before you request a quote for the HAD8613-A die bonder, check the wafer-stage specs: a 7.6-inch die field, a 2 mm Z stroke, and a loading workbench with 0.5 μm resolution. Verified specs inside.

For mini-chip die attach at ±10 µm, the HAD8613-A places 3×5–120×120 mil dies at 0° or 90° with 30–250 g bond force and handles 8-inch wafer rings.

HAD8613-A die bonder places mini chips at ±10 μm accuracy with dual-head design and automated vision alignment for semiconductor and LED PCB assembly.