Sep 16, 2026
HAD8613-A Die Bonder by Southern Machinery: Mini-Chip Die Attach Selection Guide
For mini-chip die attach at ±10 µm, the HAD8613-A places 3×5–120×120 mil dies at 0° or 90° with 30–250 g bond force and handles 8-inch wafer rings.
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For mini-chip die attach at ±10 µm, the HAD8613-A places 3×5–120×120 mil dies at 0° or 90° with 30–250 g bond force and handles 8-inch wafer rings.