HAD8613-A Die Bonder by Southern Machinery: Mini-Chip Die Attach Selection Guide

The HAD8613-A is built for mini-chip die attach, where LED-class speed gives way to ±10 µm accuracy and a fixed 0° or 90° bond angle.

What is the HAD8613-A used for?

An automatic die bonder for mini-chip products — dies from 3×5 to 120×120 mil, supplied from an 8-inch iron wafer ring.

• The first head picks the die from the automatic crystal expander.
• A voice-coil second head places it at 0° or 90°, bonding at 30–250 g.
• Vision confirms orientation before bonding.

Verified specifications from the product catalog

| Parameter | HAD8613-A |

| --- | --- |

| Placement accuracy | ±10 µm |

| Angle / accuracy | 0° and 90° / ±1° |

| Cycle time | 1,200 ms |

| Bond pressure | 30–250 g |

| Chip size | 3×5–120×120 mil |

| Max wafer ring | 8 inch (iron) |

| Vision | 256-level grey, 720×540 px, ±3 µm @ 50 mil |

Taken from the HAD8613-A column in the product page tables; confirm at quotation.

Choosing a die bonder by product class

| Model | Specified for | Accuracy | Angles | Cycle time |

| --- | --- | --- | --- | --- |

| HAD 812 plus | Semiconductor | ±20 µm | 0° | 211 ms |

| HAD8613-A | Mini chip | ±10 µm | 0°/90° | 1,200 ms |

| GTS T100BH-PA | LED products | ±25 µm | 16 angles | 42 ms |

There is a direct trade-off between accuracy and cycle time.

How it fits into the assembly flow

1. The wafer ring loads onto the automatic crystal expander.
2. The first head picks the die and orients it on the calibration platform.
3. Vision verifies orientation before bonding.
4. The second head places and bonds at 30–250 g.

ROI perspective

Payback comes from placement accuracy and eliminating manual die handling. The HAD8613-A suits high-mix work where one machine changes over between products rather than dedicating a line to each die type.

About Southern Machinery

Founded in 2011 in Shenzhen, Southern Machinery supplies cost-effective SMT and THT automation — insertion, placement, soldering, handling, cleaning, and inspection — to more than 237 customers worldwide. Its systems are CE/RoHS compliant and backed by global training and spare parts.

FAQ

What is a die bonder used for?

It picks a die from a wafer and bonds it to a PCB or substrate with controlled force and angle.

Why two heads?

The first head picks up the die, while a voice-coil head completes the 0° or 90° placement at ±10 µm.

What wafer ring size?

Up to an 8-inch iron wafer ring, with an automatic crystal expander.

Can it bond LED dies?

LED-class dies are handled by the GTS T100BH-PA (±25 µm, 16 angles, 42 ms).

Next steps

Send your die size, wafer ring, and target output to confirm the setup.

• Email: jasonwu@smthelp.com | WhatsApp: +86 13602562576
• Product page: https://www.smthelp.com/had8613-a-die-bonder.html
• Catalog: https://file.autoinsertion.com | Images: https://ph.smthelp.com
• Video: https://www.youtube.com/watch?v=e_rCdFx-E4g

Published by Southern Machinery — SMT/THT PCB Assembly Automation Lines, est. 2011, Shenzhen.