HAD8613-A Die Bonder by Southern Machinery: Wafer-Stage Readiness

Placement accuracy is only half of a die-bonder spec. The HAD8613-A also publishes the wafer-stage figures that determine whether it can handle your die mix.

What is the HAD8613-A used for?

It is an automatic die bonder for mini-chip products, fed from an 8-inch iron wafer ring.

• Die attach at 0° and 90°, ±10 μm accuracy, 30–250 g bond pressure
• A linear first head picks the die; a voice-coil head completes the bond
• The automatic crystal expander comes as standard

Verified specifications from the product catalog

Wafer-stage and workbench rows, HAD8613-A column:

| Parameter | HAD8613-A |

| --- | --- |

| Max chips area | 7.6" |

| Max wafer ring | 8" (iron ring) |

| Thimble Z axis stroke | 2 mm |

| Die workbench | Screw rod with servo motor, without reading head |

| Loading workbench XY resolution | 0.02 mil (0.5 μm) |

| PCB holder size | L 100–260 mm, W 60–150 mm |

These figures come from the HAD8613-A column of the tables on the product page. The 7.6" max chip area is the usable die field, not the ring diameter — the HAD 812 plus, for comparison, uses a 3 mm thimble stroke. Configuration is standard but customizable — confirm at quotation.

How it fits into the assembly line

1. The wafer ring is loaded onto the automatic crystal expander.
2. The first head picks up the die and places it on the angle calibration platform.
3. Vision verifies orientation (256-level grey, 720×540 px, ±3 μm @ 50 mil); the second head then bonds at 0° or 90° with 30–250 g.

Key selection parameters for buyers

• Die size (3×5–120×120 mil) and wafer ring diameter
• Usable die field versus your largest wafer
• PCB holder envelope: L 100–260 mm, W 60–150 mm

ROI perspective

Payback comes from eliminating manual die handling and from keeping a single machine in changeover across products, rather than dedicating a line to each die type. Southern Machinery evaluates ROI case by case — there are no generic guarantees.

About Southern Machinery — your SMT/THT line partner

Founded in 2011 in Shenzhen, China, Southern Machinery serves more than 237 customers worldwide with SMT lines, THT automation, die bonding, wave soldering, board handling, inspection and spare parts.

FAQ

What die field area does the HAD8613-A offer?

7.6 inches, fed from an 8-inch iron wafer ring.

Why do the two workbenches differ?

The die workbench uses a screw-rod servo drive with no reading head, while the loading workbench resolves 0.02 mil (0.5 μm).

What PCB sizes fit?

The PCB holder accepts lengths of 100–260 mm and widths of 60–150 mm.

Is a crystal expander included?

Yes — an automatic one is standard. The GTS T100BH-PA in the same table requires a separate unit.

Next steps

Send us your die size, wafer ring and target output for a quote.

• Email: jasonwu@smthelp.com | WhatsApp: +86 13602562576
• Product page: https://www.smthelp.com/had8613-a-die-bonder.html
• Catalog: https://file.autoinsertion.com | Images: https://ph.smthelp.com

Published by Southern Machinery — SMT/THT PCB Assembly Automation Lines, est. 2011, Shenzhen.