HAD8613-A Die Bonder by Southern Machinery - precision die attach for mini chip assembly
HAD8613-A die bonder places mini chips at ±10 μm accuracy with dual-head design and automated vision alignment for semiconductor and LED PCB assembly.
Aug 7, 2026 · Updated Aug 7, 2026 · Southern Machinery
HAD8613-A Die Bonder by Southern Machinery
Precision die attach for mini chip assembly: the HAD8613-A combines a linear die bonder head with a voice-coil second head and automated vision alignment to place miniature chips at ±10 μm accuracy.
What is this machine used for?
The HAD8613-A bonds mini chips (3×5 to 120×120 mil) onto PCB or substrate for semiconductor and LED products:
- Mini chip die attach with 0° and 90° placement
- Dual-head design: one head absorbs the chip, the other completes the bond
- Modular design suits low-volume, high-mix production (QFP, BGA)
Verified specifications from product catalog
Taken directly from the Southern Machinery product page (HAD8613-A column):
| Parameter | HAD8613-A value |
| --- | --- |
| Positioning accuracy | ±10 μm |
| Placement angle | 0° and 90° |
| Angle accuracy | ±1° |
| Chip size range | 3×5 – 120×120 mil |
| Die bond pressure | 30 – 250 g |
| Cycle time | 1200 ms |
| Max wafer ring size | 8" (iron ring) |
| Vision system | 256-level grey, 720×540 px, ±3 μm @50 mil |
| PCB holder size | L 100–260 mm, W 60–150 mm |
| Machine dimensions | 1600 × 1420 × 1840 mm |
Standard configuration (customizable). Buyers should confirm parameters during quotation.
How it fits into a complete PCB assembly line
- Wafer ring loads onto the auto crystal expander
- First head absorbs the die from the wafer
- Angle calibration platform verifies orientation
- Second head places the chip at 0° or 90° with 30–250 g bond pressure
- Boards move to curing/reflow, then SMT placement and inspection
Key selection parameters for buyers
- Chip size and wafer ring diameter
- Bond pressure, placement angle, and target throughput
- PCB holder size and line integration
ROI perspective
Die attach automation removes manual placement labor, and automated vision alignment cuts defect and rework rates. Precision bonding also reduces material waste. Southern Machinery provides case-by-case ROI modeling — no generic guarantees.
About Southern Machinery — your SMT/THT line partner
Founded 2011 in Shenzhen, China, Southern Machinery serves 237+ global customers with SMT lines, THT automation, wave soldering, board handling, inspection, training and spare parts.
FAQ
What accuracy does the HAD8613-A achieve?
±10 μm positioning with ±1° angle accuracy.
Which chip sizes can it bond?
Chips from 3×5 to 120×120 mil.
What wafer ring does it accept?
8-inch iron wafer rings with auto crystal expander.
Can it place chips at 90°?
Yes — 0° and 90° via the angle calibration platform.
What PCB sizes fit?
PCB holder: length 100–260 mm, width 60–150 mm.
Next steps
Email: jasonwu@smthelp.com | WhatsApp: +86 13602562576
Catalog: https://file.autoinsertion.com
Images: https://ph.smthelp.com
Video: https://www.youtube.com/watch?v=oke6c7MZXyU
Published by Southern Machinery — SMT/THT PCB Assembly Automation Lines. Serving 237+ global EMS, ODM, automotive, and medical electronics manufacturers.
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