Vacuum Reflow Oven

Vacuum time, pressure, hold and deflation are all free-set on the S-V8000 vacuum reflow oven, cutting solder voids to 3% or less and logging PCB temperature curves.

The S-V8000 vacuum reflow oven features 8/8 preheat zones, a 3000 mm heating tunnel, and 10–100 Pa vacuum, reducing solder void rates to as low as 3% for BGA, IGBT, and LED package soldering.