X-Ray BGA & QFN Void Analysis for High-Reliability PCBA by Southern Machinery

Use an SMT X-ray inspection system to find BGA and QFN voids before field failure: 460x360mm image area, 1000x system magnification, leakage <=0.5uSv/h.

Sep 9, 2026 · Updated Sep 9, 2026 · Southern Machinery

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