S-RO200 Lead-Free Reflow Oven from Southern Machinery

A reflow oven is judged by the profile it can hold. The S-RO200 operation manual documents how it achieves that profile, from heater construction to the IPC window.

How the S-RO200 heats a board

A high-nickel heating wire inside a metal tube packed with calcium silicate transfers heat to a storage plate and the surrounding air. Each plate has inner 6 mm and outer 8 mm hot-air circulation holes on a 25 mm pitch, blowing laminar hot air onto the PCB. Solder beneath shadowed components is heated directly, and component masses equalize.

The eight-zone architecture

Upper zones 1 to 4 run preheat, first dry, second dry, and reflow; lower zones 5 to 8 repeat them underneath. An industrial control computer monitors each zone with PID control and a high-power SSR driver, and each zone has a thermocouple static detection point tested at the factory. The manual specifies two heater element sets for the upper zone: 6 kW starting power and 3 kW working power. General machines finish on a natural cooling curve.

Verbatim from the product page.

The IPC profile window

| Stage | Target |

| --- | --- |

| Ramp | Room temperature to 120-150 C in about 60 s, at 3 C/s or less |

| Soak | 90-150 s stabilized at about 150 C, below the 183 C melting point |

| Reflow | 30 s from 183 C to 210-230 C |

Line B covers fine-pitch ICs and tiny components such as 1005; Line C covers SMD adhesive curing at 150 C for 3-5 minutes.

Top and bottom heating strategy

Upper and lower heaters are independent. About half of the total energy is used in the bottom preheat zone, pre-warming the board evenly and reducing component heat absorption; only a little goes to the top, minimizing warpage.

ROI perspective

A documented profile turns reflow from trial and error into a repeatable recipe, cutting scrap and rework.

About Southern Machinery

Founded in 2011 in Shenzhen, Southern Machinery serves 237+ customers worldwide with SMT/THT assembly, wave soldering, board handling, and inspection equipment.

FAQ

What is the 183 C figure in the profile?

The solder paste melting point that the soak stage stays below, so the board equalizes before the alloy liquefies.

Why does the bottom preheat zone matter?

It carries roughly half of total energy, warming the board evenly and reducing damaging heat absorption.

How is mesh speed related to the profile?

It sets dwell time; thicker boards get longer dwell for balanced heating.

Does the S-RO200 handle flexible boards?

Yes, direct hot-air transfer is documented for different board materials, including flexible panels.

Next steps

• Email: jasonwu@smthelp.com | WhatsApp: +86 13602562576
• Catalog: https://file.autoinsertion.com | Images: https://ph.smthelp.com
• Product page: https://www.smthelp.com/s-ro200-lead-free-reflow-oven-operation%e2%80%a8-user-manual.html

Southern Machinery - SMT/THT PCB Assembly Automation Lines. 237+ global customers.